Amphenol's BarKlip series Busbar OCP power connector

BarKlip from Amphenol ®  The I/O series provides convenient and customizable power distribution solutions, suitable for high current distribution between busbars, cables, and circuit boards. These board to bus connectors comply with the OCP V3 distribution architecture standard and are an ideal choice for power racks, battery backup units (BBUs), servers/storage devices, electric vehicle charging stations, and other high current applications in data centers. BarKlip ®  BK350 and BarKlip ®  BK600 supports OCP ORv3 architecture and is suitable for various application scenarios. Our bus I/O connectors comply with OCP ORv3 and OCP ORv2 standards. The ultrasonic welding connection between the wire and the contact improves the efficiency and reliability of current transmission, while the direct insertion connection with the non insulated busbar achieves extremely low energy loss. These products are ideal for high current applications such as high-power density data centers, OCP racks and power solutions, electric vehicle charging stations, UPS, and network equipment.